Applications[ 产品用途 ]
本机主要适用与石英晶片、光学水晶、蓝宝石、铌酸锂、玻璃、陶瓷片等薄脆金属或非金属材料的双面研磨或抛光。
It fits optic crystal,glass,quartz crystal slice,porcelain slice,LiNb03,sapphire and metal,nonmetal brittleness material both and single side polishing andrubbing of pressurizing components.
Main Features [ 主要特点 ]
采用交流滑差电机驱动，软启动、软停止、运转较稳定。 下研磨盘可升降，摆放工件和取下工件都很方便。上盘设置了缓解，不但有效防止了薄脆工件的破碎，而且还可独立进行压力控制。
使用了压力预置计数方式控制研磨压力，研磨的圈数，要求可准确控制。可以采用修盘方式修整研磨盘。
根据用户要求，可与 ALC （频率监控仪）的连接，可以采用触摸屏与PLC 程序控制，可以采用交流变频电机驱动。
Drove by electric machine,soft start and stop,stabilization,less impaction.Low-tray can be risen and fallen,which makes operate easily.Slow falling installed in the up-tray to prevent the crash of brittleness slice,and pressure control can be separately operated.
Pressure count presetting can make control more accurate.Rubbing tray can be adjusted.
ALC can be connected; revolution,speed and pressure can be adjusted by touchable screen and PLC program as required .Can be driven by AC frequency conversion electric machine. |
