Applications [ 产品用途 ] 
本机主要适用于硅片、石英晶片、 SMD 表面贴装晶体、光学水晶、铌酸锂、玻璃、陶瓷片等薄脆金属或非金属材料的双面研磨或抛光。
It fits SMD surface crystal,optic crystal,optic glass, semiconductor silicon slice, quartz crystal slice, piezoelectricity porcelain, arsenide gallium,LiNb03, molybdenum slice and metal, nonmetal brittleness material both single side polishing and rubbing of pressurizing cmponets.
Main Features [ 主要特点 ]
采用交流变频电机驱动，软启动、软停止、平稳可靠，冲击小。
油压升降齿圈，非常平稳；太阳轮下有垫片可调整位置，有效利用了齿
圈和太阳轮。上盘设置了缓解，不但有效防止了薄脆工件的破碎，而且还可独立进行压力控制。
该设备可单独进行压力控制，而且压力大小，在该压力状态下的转数，能据工艺要求程序化设置控制。可以采用修盘方式修整研磨盘。
根据用户要求，可与 ALC （频率监控仪）的连接，可以采用可以采用触摸屏与PLC 程序控制，压力大小，转数及速比设置等，都能据工艺要求程序化设置控制。
Drove by AC frequency conversion electric machine ,soft start and stop ,stabilization,less impaction.
Oil pressed tooth ciecle and adjustable mat under solar wheel make it stabilize,
Slow falling installed in the up-tray to prevent the crash of brittleness slice,and pressure control can be separately operated.
The pressure control equipment alone ,but the size of the pressure, the pressure uder the condition of revolutions, It can set up procedures to control technology requirements. Rubbing tray can be adjusted.
ALC can be connected; revolution, speed and pressure can be adjusted by touchable screen and PLC program as required. |
